Characterization

Characterization Techniques

Available characterization includes optical microscopy (OM), scanning electron microscopy (SEM), electron probe microanalysis (EPMA), differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), electron backscatter diffraction (EBSD), X-ray diffraction (XRD), laser flash analysis (LFA), transmission electron microscopy (TEM), focused ion beam (FIB), and hardness, tensile and impact testing.

In-house Instruments

  • 光學顯微鏡

    Optical Microscope

    金相與微結構觀察。

  • 萬能試驗機

    Universal Testing Machine

    拉伸等力學試驗。

  • 維克氏硬度機

    Vickers Hardness Tester

    硬度與微硬度量測。

  • 衝擊機

    Impact Tester

    衝擊試驗。

  • DSC熱分析儀

    DSC Thermal Analyzer

    熱分析。

Additional Techniques

  • Scanning Electron Microscopy

    掃描式電子顯微鏡

  • Electron Probe Microanalysis

    電子探針微分析

  • Thermogravimetric Analysis

    熱重分析

  • Electron Backscatter Diffraction

    電子背向散射繞射

  • X-ray Diffraction

    X 光繞射

  • Laser Flash Analysis

    雷射閃光法

  • Transmission Electron Microscopy

    穿透式電子顯微鏡

  • Focused Ion Beam

    聚焦離子束